Fabrinet's trading volume on February 24th was $369 million, ranking 337th among U.S. stocks on that day.

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On February 24, 2026, electronic manufacturing services company Fabrinet (FN) had a trading volume of $369 million, ranking 337th among U.S. stocks that day. The trading volume decreased by 16.76% compared to the previous day, with a daily trading volume of 623,400 shares.

Fabrinet (FN) rose 1.59% on February 24, 2026, closing at $585.87. The stock increased by 17.93% over the past 5 trading days, 19.70% for the entire month of February, 28.68% since the beginning of the year, and 173.27% over the past 52 weeks.

If the company has been listed for less than 52 weeks, the 52-week change is calculated from the listing date to the present (this also applies to companies listed for less than 1 month or fewer than 5 trading days).

Fabrinet (FN) Trading Volume / USD Change from Previous Day Volume
February 24, 2026 $369 million -16.76% 623,400 shares
February 23, 2026 $444 million +5.67% 787,500 shares
February 20, 2026 $420 million +158.40% 773,500 shares
February 19, 2026 $162 million -44.08% 322,200 shares
February 18, 2026 $291 million +52.17% 568,100 shares

Fabrinet released its fiscal year 2026 interim report on February 3, 2026. Revenue from June 28, 2025, to December 26, 2025, was $2.111 billion, representing a 28.89% year-over-year increase. Net profit was $209 million, up 27.14% year-over-year.

Founded on August 12, 1999, Fabrinet is an exempt company registered in the Cayman Islands, British Virgin Islands. The company provides advanced optical packaging and precision optical, electromechanical, and electronic manufacturing services for original equipment manufacturers (OEMs), including optical communication components, modules, and subsystems, industrial lasers, automotive parts, medical devices, and sensors. It offers a wide range of advanced optical and electromechanical capabilities throughout the manufacturing process, including process design and engineering, supply chain management, manufacturing, complex printed circuit board assembly, advanced packaging, integration, final assembly, and testing.

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