Shenzhen: Supports Rapid Application and Iteration of Domestic GPU, NPU, CPU, DPU and Other Core Chip Products

Shenzhen Municipal Bureau of Industry and Information Technology recently issued the “Action Plan for Accelerating the High-Quality Development of the Artificial Intelligence Server Industry Chain (2026–2028).” The plan proposes supporting domestic GPU, NPU, CPU, DPU, and other core chip products to accelerate application and iteration, forming a complete industrial ecosystem. It encourages R&D and industrialization of high-performance computing chips based on RISC-V architecture, developing high-speed Ethernet switching chips, PCIe/CXL switching chips, and promoting technological iteration and performance upgrades. It supports the development and application of third-generation semiconductor power devices, the creation of scenario-specific power supply solutions, and forward-looking layout of next-generation power semiconductor technologies.

Shenzhen’s Action Plan for Accelerating the High-Quality Development of the Artificial Intelligence Server Industry Chain (2026-2028)

To seize the commanding heights of AI industry technological development, accelerate the high-quality development of the AI server (hereinafter referred to as AI servers) industry chain, and pioneer new forms of intelligent economy, Shenzhen aims to build a global AI pioneer city. In accordance with the “Opinions of the State Council on Deepening the Implementation of the ‘AI+’ Action” and other documents, combined with local realities, this plan has been formulated.

1. Development Goals

Leverage Shenzhen’s advantages in new-generation electronic information, artificial intelligence, new energy, and other industries. Adhere to innovation-driven, software-hardware synergy, ecological cultivation, and open cooperation. Promote innovation and clustering across the entire AI server industry chain, including R&D and design, core components and complete machine manufacturing, system integration, and supporting services. Foster collaboration among large, medium, and small enterprises, close cooperation among upstream and downstream companies, and integrated production, supply, and sales links. Build the most complete industry support, the most efficient resource allocation, and the best innovation ecology for AI servers, creating a large-scale intelligent computing cluster R&D and manufacturing hub. This will support Shenzhen in becoming a leading global advanced manufacturing center and a significant industry and technological innovation hub.

By 2028, the capacity and shipment volume of the entire AI server industry chain products will see leapfrog growth. Key areas such as core chips, storage, printed circuit boards (PCBs), power storage, optical modules, and passive components will significantly increase their global market share. Achieve technological breakthroughs in core chips and key products, cultivate a batch of technically proficient and market-advantaged “specialized, refined, distinctive, and innovative” (“specialized and innovative”) enterprises and “single champion” companies, forming a tiered industry development pattern of large, medium, and small enterprises.

2. Key Areas

(1) Core Chips. Support domestic GPU, NPU, CPU, DPU, and other core chip products to accelerate application and iteration, forming a complete industry ecosystem. Encourage R&D and industrialization of high-performance computing chips based on RISC-V architecture. Develop high-speed Ethernet switching chips, PCIe/CXL switching chips, and promote technological iteration and performance upgrades. Support third-generation semiconductor power device R&D and application, develop scenario-specific power supply solutions, and proactively layout next-generation power semiconductor technologies.

(2) Storage Products. Support R&D and application of storage chips, accelerate advanced packaging technology breakthroughs for storage chips, and focus on high-end storage products such as enterprise SSDs and enterprise memory modules. Strengthen research on near-memory packaging and compute-in-memory technologies, improve high-end storage supply capacity, and build a supply system for high-end storage products suitable for large model training and supercomputing centers.

(3) Printed Circuit Boards. Rely on Shenzhen’s global PCB manufacturing core base, focus on developing multi-layer high-speed boards for AI servers, rigid-flex combination boards, flexible boards, advanced packaging substrates, ultra-high-density HDI boards (6 layers and above), and ABF substrates. Promote large-scale application of cutting-edge low-dielectric high-end substrates. Strengthen R&D and capacity layout for high-end carrier boards and flexible circuit boards, expand small-scale and diversified PCB customization services, and support enterprise R&D and pilot testing. Accelerate applications of specialized PCBs (for high-frequency communications), FCBGA/BT packaging substrates, and support efficient interconnection of data centers and backbone networks.

(4) Power Supply and Energy Storage. Accelerate the empowerment of “Lithium Battery+” advantages, continuously improve the “depth” of UPS, 800V high-voltage DC power supplies, lithium/sodium energy storage systems, and other products. Strengthen the capability leap in power electronics, promote iteration of new-generation HVDC power supply solutions, and accelerate R&D of high-voltage SiC MOSFETs, high-frequency GaN power devices, multi-phase controllers, intelligent power stages (DrMOS), and highly integrated power modules. Tailor solutions to domestic and international market demands, create benchmark zero-carbon data centers with “photovoltaic/offshore wind + energy storage + green power direct connection,” and support local consumption of computing power and efficient use of green electricity. Innovate power supply energy storage participation in virtual power plants and explore integrated source-grid-load-storage business models.

(5) Optical Modules. Promote optical module upgrades from 800G to 1.6T/3.2T generations, support mass production projects for 800G and above optical modules; focus on developing high-speed, low-power silicon photonic modules, CPO/LPO/NPO packaged optical modules, and breakthroughs in core technologies such as high-end thin-film lithium niobate and high-end indium phosphide. Advance the evolution and industrialization of all-optical switching technology, and enhance自主研发能力 of core materials, optical chips, and optical devices.

(6) Cooling Products. Consolidate Shenzhen’s leading position in liquid cooling cold plates, accelerate the development of immersion cooling, chip-level direct cooling, embedded microchannel liquid cooling, and other advanced cooling technologies. Improve the efficiency of high-end air cooling systems, plan for phase-change energy storage cooling, thermoelectric cooling, and other frontier directions. Focus on developing liquid-cooled server cabinets, cold plates, liquid cooling plates, high thermal conductivity interface materials, and core cooling modules. Strengthen supply of high-end components such as VC heat spreaders, 3D VC, and high-efficiency thermal gels.

(7) Passive Components. Focus on developing high-speed connectors, large-current power inductors, high-capacitance MLCCs, low-ESR high-frequency capacitors, and 3D silicon-based capacitors for AI servers. Promote iterative upgrades of high-speed connectors, power inductor magnetic core materials, and enhance mass production capabilities of integrated inductors and solid-state polymer capacitors.

(8) Complete AI Servers. Relying on Shenzhen’s advantages in complete machine R&D, manufacturing, and ecosystem support, develop core products such as all-liquid-cooled AI supernodes, high-end AI training servers, AI inference servers, and large model training and inference integrated machines. Actively layout lightweight AI integrated machines and mini hosts. Support the development of liquid-cooled CDU server cluster connection systems, strengthen and expand the complete machine integration industry, and improve ODM/OEM/JDM diversified manufacturing services. Build a full-chain service system covering design, manufacturing, testing, and delivery, and cultivate globally influential AI server brands.

3. Key Tasks

(1) Support Major Projects. Strengthen coordination among city districts and departments, make full use of national policies such as “two new” and “two heavy” projects, and support policies like technological transformation and new policy-based financial tools. Plan and layout major projects, thoroughly investigate industry chain enterprise needs, and encourage enterprise capital increase and expansion. Provide full-process services for high-end expansion projects, accelerate project landing and production.

(2) Guarantee Industrial Space by Tier and Category. Based on enterprise needs, implement tiered and categorized support for industrial space. City and district coordination, following local industrial land supply management measures, select high-end R&D and manufacturing projects, and strengthen land supply. Promote models like “industrial building up,” providing quick land access for lightweight manufacturing, R&D testing, and flexible production projects.

(3) Deepen Industry Chain Collaboration and Innovation. Explore a “chain leader sets questions, upstream and downstream answer” collaborative innovation model, leverage chain leader enterprises to lead joint R&D and technical breakthroughs. Focus on core technology R&D and industrialization for new demands of AI servers in frontier sectors. Support upstream enterprises to enter leading enterprise supply chains through policies like first sets, first batches, and first versions, accelerating the application of domestically produced equipment, components, materials, and software.

(4) Enhance Resilience and Security of the Industry Chain. Implement national strategies for high-quality development of key industry chains, guide enterprises to strengthen and stabilize the manufacturing chain. Utilize international trading centers for electronic components and integrated circuits for diversified reserves, trading, user procurement, and cross-border services to ensure supply chain stability. Attract upstream core materials, components, and other enterprises through chain-led招商, support enterprises to establish regional headquarters, R&D centers, and production bases in Shenzhen, and improve the AI server industry chain layout.

(5) Build a Healthy Industry Ecosystem. Promote regular cooperation mechanisms between chain leader enterprises, cloud service providers (CSPs), and large model companies, accelerate deep adaptation of AI computing infrastructure technology systems, and support the healthy development of domestic AI computing ecology. Promote large-scale application of domestic computing chips, attract supporting enterprises for chip ecosystems, and foster a virtuous cycle of “application-driven technological iteration.” Support deep integration of open-source Hongmeng, open-source Euler, and RISC-V architectures to create a new ecosystem combining operating systems and RISC-V in the AI server field.

(6) Promote Coordinated Development of Manufacturing and Services. While enhancing the manufacturing level of the entire AI server industry chain, support the development of system integrators and computing infrastructure enterprises in cluster planning, system integration, computing leasing, model training, and operation management. Build an “end-to-end, green, reliable” integrated solution of “hardware + algorithms + services.” Support OEMs to transform into system service providers, offering full lifecycle services from planning and deployment to intelligent operation and maintenance. Encourage cloud service providers and AI companies to participate deeply in hardware customization, forming a positive cycle of demand-driven supply and supply-driven demand. Leverage Shenzhen’s advantages in software and information services to promote coordinated development of AI servers, large industry models, and intelligent computing platforms, creating a globally leading AI computing infrastructure service ecosystem.

(7) Optimize Full-Cycle Investment and Financing Services. Strengthen support for small and medium-sized enterprises, especially early and mid-stage startups in the industry chain. Promote government investment funds to invest in high-quality AI server industry projects. Deepen cooperation between government investment funds and top corporate venture capital (CVC), providing funding and supply chain support. Establish platforms for bank-enterprise and capital-enterprise matchmaking, reduce financing costs, and assist enterprises in connecting with capital markets and going public.

(8) Improve Talent Development System. Encourage local universities to add relevant majors and expand enrollment. Deepen industry-education integration, jointly build industry colleges and training bases with top enterprises and universities to supply skilled talent. Utilize talent policies to improve housing, healthcare, and other supporting services, attracting skilled professionals to Shenzhen and stabilizing the workforce.

4. Support Measures

(1) Focus on Task Implementation. At the municipal level, coordinate industry development, formulate overall strategies, proactively serve enterprises, and strengthen financial support; at the district level, clarify responsibilities, implement detailed measures, and prioritize industrial land, housing, and financing needs. Use models like “industrial building up” to quickly match high-quality industrial space and promote efficient project landing, ensuring supporting services.

(2) Improve Working Mechanisms. Under the “20+8” strategic emerging industry cluster framework, promote close cooperation among industry authorities, planning, natural resources, ecological environment, water departments, and districts. Fully align with national and provincial AI and infrastructure development plans, mobilize resources, and support the development of AI server enterprises and major projects. Strengthen policy coordination and targeted support.

(3) Enhance Support Systems. Support the construction of public technological pilot platforms, integrating R&D, testing, intellectual property, compliance certification, and enterprise services to provide full-cycle, inclusive professional services. Leverage industry associations and research institutions to strengthen industry research, exchanges, and talent training, empowering industry development.

(Article source: People’s Financial News)