Nearly 40 Sci-Tech Innovation Board "Hard Technology" companies showcased at the global semiconductor industry's annual event

Securities Daily reporter Mao Yirong

The global semiconductor industry annual event SEMICONChina2026 will be held in Shanghai from March 25 to 27. This year’s exhibition, themed “Cross-Border Global, Heart and Core Connected,” brings together over 1,500 upstream and downstream companies, attracting more than 180,000 professional visitors to participate in the grand event.

The Securities Daily reporter noted that nearly 40 Sci-Tech Innovation Board companies, including Zhiwei Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as “Zhiwei”), Tuojing Technology Co., Ltd. (hereinafter referred to as “Tuojing Technology”), Huahong Semiconductor Limited (hereinafter referred to as “Huahong”), and Shanghai Gai Lun Electronics Co., Ltd. (hereinafter referred to as “Gai Lun Electronics”), showcased their heavyweight products and latest achievements, demonstrating the innovative strength and complete ecosystem of China’s semiconductor industry to the world through a series of new product launches and cutting-edge technology displays.

Focusing on Three Core Trends

The reporter noted that Feng Li, President of SEMI (Semiconductor Equipment and Materials International) China, mentioned in the opening keynote speech at this exhibition that, driven by AI computing power and the global digital economy, the global semiconductor industry has ushered in a historic moment, with the “chip era,” originally expected to reach a trillion-dollar valuation by 2030, likely to arrive ahead of schedule by the end of 2026. At the same time, the three major trends in the semiconductor industry in 2026 include AI computing power, a storage revolution, and industry upgrades driven by advanced packaging technologies.

These three high-growth tracks are currently the core areas of focus for Sci-Tech Innovation Board semiconductor companies. At present, the Sci-Tech Innovation Board has gathered 128 listed semiconductor companies, accounting for 60% of the total number of semiconductor companies in A-shares, covering the entire industry chain, including design, manufacturing, equipment, and materials, with IPO financing exceeding 300 billion yuan, forming a development pattern characterized by leading firms, complete chains, and collaborative innovation.

Among them, in the AI computing power sector, companies such as Cambrian Technology Co., Ltd., Haiguang Information Technology Co., Ltd., Moore Threads Intelligent Technology (Beijing) Co., Ltd., and Muxi Integrated Circuit (Shanghai) Co., Ltd. have gathered. In the storage sector, Shenzhen Bawei Storage Technology Co., Ltd. has benefited from the industry’s recovery, and the domestic storage foundry giant Changxin Technology Group Co., Ltd. has had its Sci-Tech Innovation Board IPO accepted. Advanced packaging has also become the core technology direction that Sci-Tech Innovation Board testing and equipment companies are collectively betting on.

Intensive New Product Releases

At the exhibition site, new product releases from leading Sci-Tech Innovation Board equipment companies were particularly eye-catching, showcasing a strong trend of transitioning from single-point breakthroughs to multi-category and platform-based advancements.

As a benchmark for domestic etching equipment, Zhiwei launched four new products covering key processes for silicon-based and compound semiconductors at this year’s exhibition, becoming the center of attention and further enriching the company’s product portfolio and systematic solutions in the fields of etching equipment, thin-film deposition equipment, and core smart components, continuously consolidating the foundation for platform-based development.

Tuojing Technology has successfully expanded into the advanced packaging field in recent years, leveraging its deep accumulation in the thin-film deposition area. The 3DIC series new products displayed at this exhibition include several products such as fusion bonding and laser peeling, focusing on advanced logic chip Chiplet heterogeneous integration, three-dimensional stacking, and HBM-related applications.

In the wet processing equipment sector, Semitool Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as “Semitool Shanghai”) has reorganized its product line and refreshed its brand, officially launching a new product combination architecture called “Semitool Chip.” Huahai Qingshi Co., Ltd. showcased a full range of advanced semiconductor equipment and process integration solutions, bringing a large beam ion implanter iPUMA-LE in the ion implantation field where the domesticization rate is relatively low.

In the field of measurement, Shenzhen Zhongke Feice Technology Co., Ltd. (hereinafter referred to as “Zhongke Feice”) exhibited a total of 16 semiconductor quality control devices and three intelligent software products, including electron beam critical dimension measurement devices, optical diffraction overlay accuracy measurement devices, wafer flatness measurement devices, and high aspect ratio etching structure measurement devices.

In the EDA sector, the first domestic EDA listed company—Gai Lun Electronics—officially launched the P1800 series precision source measurement units developed based on independently owned SMU technology, which means that the company’s semiconductor device characterization testing business has formed a complete product line that includes benchtop instruments, electrical parameter testing, low-frequency noise testing, specialized electrical testing software, and parameter testing systems.

In the materials sector, Xi’an Yiswei Material Technology Co., Ltd. (hereinafter referred to as “Xi’an Yicai”) showcased a full range of 12-inch silicon wafer products and full-process technology, with its high-quality products widely adaptable to core areas such as high-performance storage chips, advanced logic chips, analog chips, and image sensor chips, meeting the demands of emerging markets like AI computing power, smart driving, and data centers.

Collaborative Breakthroughs Across the Entire Industry Chain

With the successful holding of the SEMICONChina2026 annual event, Sci-Tech Innovation Board semiconductor companies have showcased the confidence and strength of China’s emerging pillar industry development through tangible technological breakthroughs and collaboration across the industry chain.

Sci-Tech Innovation Board semiconductor companies are no longer “fighting alone” with single-point breakthroughs, but are exhibiting a positive trend of “collaborative operations” across the entire industry chain, advancing towards a full-chain technical integration.

On the manufacturing side, companies like Semiconductor Manufacturing International Corporation (SMIC) and Huahong maintain high capacity utilization rates and reasonable capital expenditures, with sales consistently ranking among the top of the global pure wafer foundry companies.

On the equipment side, Zhiwei, Tuojing Technology, Semitool Shanghai, Zhongke Feice, Beijing Yitang Semiconductor Technology Co., Ltd., and Shenyang Fuchuang Precision Equipment Co., Ltd. have achieved technology benchmarks against international giants in areas such as etching, thin-film deposition, cleaning, measurement, thermal processing, and precision components.

On the materials side, companies like Xi’an Yicai, Shanghai Silicon Industry Group Co., Ltd., Shandong Tianyue Advanced Technology Co., Ltd., and Guangdong Huate Gas Co., Ltd. have made breakthroughs in critical areas such as large silicon wafers, silicon carbide substrates, and electronic special gases, strongly supporting the construction of China’s semiconductor manufacturing localized supply chain system.

Mergers and Acquisitions Activate Industrial Momentum

Under the empowerment of the “Eight Articles of Sci-Tech Innovation Board” and “Six Articles of Mergers and Acquisitions” policies, mergers and acquisitions have become an important way for Sci-Tech enterprises to quickly acquire technological capabilities and achieve “strong chain, supplement chain, and extend chain” in the industry.

According to statistics, since the release of the “Eight Articles of Sci-Tech Innovation Board,” as of March 26, over 50 semiconductor industry mergers and acquisitions have been disclosed on the Sci-Tech Innovation Board, with disclosed transaction amounts exceeding 70 billion yuan, showing a rapid momentum for industry consolidation.

At this exhibition, the merger and acquisition progress of several participating companies has become a focus of industry attention. Zhiwei plans to acquire the domestic high-end CMP equipment company Zhonggui Technology to fill the product gap in the wet processing equipment field and accelerate the transformation into a world-class platform semiconductor equipment group; the transaction of Gai Lun Electronics acquiring Ruicheng Chip Micro has entered the exchange review inquiry stage, aiming to create a complete solution for EDA and IP collaboration; Huahong plans to acquire its brother company Huali Micro from its controlling shareholder, fulfilling the commitment to solve industry competition during the IPO phase and achieving capacity expansion and process collaboration to improve profitability. Additionally, the transaction design of Shanghai Jingfeng Mingyuan Semiconductor Co., Ltd.'s acquisition of Yichong Technology and other typical cases has fully considered the particularity of technology asset valuation.

Market participants said that mergers and acquisitions not only help listed companies become stronger but also promote the optimization and upgrading of the industrial ecosystem. Through mergers and acquisitions, companies can quickly achieve technological complementarity and market expansion, moving from basic resource integration to a new stage of technological collaborative innovation, which is a vivid practice of the Sci-Tech Innovation Board supporting the development of new productivity.