💥 Gate Square Event: #PostToWinCC 💥
Post original content on Gate Square related to Canton Network (CC) or its ongoing campaigns for a chance to share 3,334 CC rewards!
📅 Event Period:
Nov 10, 2025, 10:00 – Nov 17, 2025, 16:00 (UTC)
📌 Related Campaigns:
Launchpool: https://www.gate.com/announcements/article/48098
CandyDrop: https://www.gate.com/announcements/article/48092
Earn: https://www.gate.com/announcements/article/48119
📌 How to Participate:
1️⃣ Post original content about Canton (CC) or its campaigns on Gate Square.
2️⃣ Content must be at least 80 words.
3️⃣ Add the hashtag #PostTo
Tongfu Microelectronics: The company's optoelectronic packaging (CPO) related products have passed preliminary reliability testing.
Jin10 data September 16 news, Tongfu Microelectronics announced the record of investor relations activities, stating that in the first half of the year, the company made significant progress in the development of large-size FCBGA, where large-size FCBGA has entered mass production stage, and ultra-large-size FCBGA has completed preliminary research and entered the formal engineering assessment phase; at the same time, the company has solved the product warpage issue and product heat dissipation issue under ultra-large size through product structure design optimization, material selection, and process optimization. In addition, the company's technical research and development in the field of Chip-on-Photon (CPO) has made breakthrough progress, and related products have passed preliminary reliability testing.